Strain amplitude response and the microstructure of PA/clay nanocomposites

Tools

Wan, T., Clifford, M.J., Gao, F. ORCID: 0000-0003-4064-9579, Bailey, A.S., Gregory, D.H. and Somsunan, R., 2005. Strain amplitude response and the microstructure of PA/clay nanocomposites. Polymer, 46 (17), pp. 6429-6436. ISSN 0032-3861

Preview

Text
196459_JPOL-S-04-00589.pdf
Download (412kB) | Preview

Official URL: http://doi.org/10.1016/j.polymer.2005.04.105

Abstract

Polyamide 6/clay nanocomposites (PAn, where n is the mass fraction of clay) with various clay loading were prepared by melt compounding in a twin screw extruder. Exfoliation of clay in a PA matrix was confirmed by X-ray diffraction. Strain amplitude response of PAn in both melt and solution states has been investigated. In the melt state, critical strain amplitude of PAn is sensitive to strain amplitude response and decrease logarithmically with increasing clay loading. The elastic moduli (G′) of PAn are reversible under frequency loop sweeps. Comparisons of strain amplitude response in both melt and solution states have been conducted. Two different responses have been observed: strain thinning in the melt state and weak strain overshoot in the solution state. FTIR studies show that amide II band of PAn shifts toward high wavenumbers, but amide I band and N–H stretching vibration are independent of clay loading. We suggest that two types of strain amplitude response of PAn can be explained: strain thinning which is dominant in PAn caused by physical adsorption and entanglement of PA chains on nanoclays and weak strain overshoot caused by weak bonds between PA chains and nanoclays.

Item Type:

Journal article

Publication Title:

Polymer

Creators:

Wan, T., Clifford, M.J., Gao, F., Bailey, A.S., Gregory, D.H. and Somsunan, R.

Publisher:

Elsevier (not including Cell Press)

Place of Publication:

Oxford

Date:

2005