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Nashed, M.-N. 
ORCID: 0000-0002-3152-4320, Hardy, D.A. ORCID: 0000-0002-6028-7555, Hughes-Riley, T. ORCID: 0000-0001-8020-430X and Dias, T. ORCID: 0000-0002-3533-0398,
2019.
A novel method for embedding semiconductor dies within textile yarn to create electronic textiles.
Fibers, 7 (2): 12.
ISSN 2079-6439
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Text
13276_Hughes-Riley.pdf - Published version Download (3MB) | Preview |
Abstract
Electronic yarns (E-yarns) contain electronics fully incorporated into the yarn’s structure prior to textile or garment production. They consist of a conductive core made from a flexible, multi-strand copper wire onto which semiconductor dies or MEMS (microelectromechanical systems) are soldered. The device and solder joints are then encapsulated within a resin micro-pod, which is subsequently surrounded by a textile sheath, which also covers the copper wires. The encapsulation of semiconductor dies or MEMS devices within the resin polymer micro-pod is a critical component of the fabrication process, as the micro-pod protects the dies from mechanical and chemical stresses, and hermetically seals the device, which makes the E-yarn washable. The process of manufacturing E-yarns requires automation to increase production speeds and to ensure consistency of the micro-pod structure. The design and development of a semi-automated encapsulation unit used to fabricate the micro-pods is presented here. The micro-pods were made from a ultra-violet (UV) curable polymer resin. This work details the choice of machinery and methods to create a semi-automated encapsulation system in which incoming dies were detected then covered in resin micro-pods. The system detected incoming 0402 metric package dies with an accuracy of 87 to 98%.
| Item Type: | Journal article | ||||
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| Publication Title: | Fibers | ||||
| Creators: | Nashed, M.-N., Hardy, D.A., Hughes-Riley, T. and Dias, T. | ||||
| Publisher: | MDPI | ||||
| Date: | February 2019 | ||||
| Volume: | 7 | ||||
| Number: | 2 | ||||
| ISSN: | 2079-6439 | ||||
| Identifiers: |
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| Rights: | © 2019 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/). | ||||
| Divisions: | Schools > School of Art and Design | ||||
| Record created by: | Jill Tomkinson | ||||
| Date Added: | 30 Jan 2019 14:37 | ||||
| Last Modified: | 30 Jan 2019 14:37 | ||||
| URI: | https://irep.ntu.ac.uk/id/eprint/35737 |
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