Ultra-thin chips for high-performance flexible electronics

Gupta, S., Navaraj, W.T. ORCID: 0000-0003-4753-2015, Lorenzelli, L. and Dahiya, R., 2018. Ultra-thin chips for high-performance flexible electronics. npj Flexible Electronics, 2 (1): 8. ISSN 2397-4621

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Abstract

Flexible electronics has significantly advanced over the last few years, as devices and circuits from nanoscale structures to printed thin films have started to appear. Simultaneously, the demand for high-performance electronics has also increased because flexible and compact integrated circuits are needed to obtain fully flexible electronic systems. It is challenging to obtain flexible and compact integrated circuits as the silicon based CMOS electronics, which is currently the industry standard for high-performance, is planar and the brittle nature of silicon makes bendability difficult. For this reason, the ultra-thin chips from silicon is gaining interest. This review provides an in-depth analysis of various approaches for obtaining ultra-thin chips from rigid silicon wafer. The comprehensive study presented here includes analysis of ultra-thin chips properties such as the electrical, thermal, optical and mechanical properties, stress modelling, and packaging techniques. The underpinning advances in areas such as sensing, computing, data storage, and energy have been discussed along with several emerging applications (e.g., wearable systems, m-Health, smart cities and Internet of Things etc.) they will enable. This paper is targeted to the readers working in the field of integrated circuits on thin and bendable silicon; but it can be of broad interest to everyone working in the field of flexible electronics.

Item Type: Journal article
Publication Title: npj Flexible Electronics
Creators: Gupta, S., Navaraj, W.T., Lorenzelli, L. and Dahiya, R.
Publisher: Nature Publishing Group
Date: 14 March 2018
Volume: 2
Number: 1
ISSN: 2397-4621
Identifiers:
NumberType
10.1038/s41528-018-0021-5DOI
21Publisher Item Identifier
Rights: This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made. The images or other third party material in this article are included in the article’s Creative Commons license, unless indicated otherwise in a credit line to the material. If material is not included in the article’s Creative Commons license and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this license, visit http://creativecommons.org/licenses/by/4.0/.
Divisions: Schools > School of Science and Technology
Depositing User: Jonathan Gallacher
Date Added: 14 Aug 2019 09:35
Last Modified: 14 Aug 2019 09:35
URI: http://irep.ntu.ac.uk/id/eprint/37293

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