Integrating flexible filament circuits for e‐textile applications

Komolafe, A., Torah, R., Wei, Y. ORCID: 0000-0001-6195-8595, Nunes‐Matos, H., Li, M., Hardy, D. ORCID: 0000-0002-6028-7555, Dias, T. ORCID: 0000-0002-3533-0398, Tudor, M. and Beeby, S., 2019. Integrating flexible filament circuits for e‐textile applications. Advanced Materials Technologies, 4 (7): 1900176. ISSN 2365-709X

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Practical wearable e‐textiles must be durable and retain, as far as possible, the textile properties such as drape, feel, lightweight, breathability, and washability that make fabrics suitable for clothing. Early e‐textile garments were realized by inserting standard portable electronic devices into bespoke pockets and arranging interconnects and cabling across the garment. In these examples, the textile merely served as a vehicle to house the electronics and had no inherent electronic functionality. A reduction in electronic component size, the development of flexible circuits, and the ability to weave robust interconnects offer the potential for improved levels of electronic integration within the textile. The weaving of electronic circuit filaments less than 2 mm wide into fabrics such that the electronics are fully concealed in the textile and given extra protection by the surrounding textile fibers is introduced. The failure mechanisms for different filament circuit designs before and after integration into the textile are investigated with a 90° cyclical bending test. Results show that encapsulated filament circuits embedded within the textile survive 45 washing cycles and more than 1500 cycles of 90° bending around a bending radius of 10 mm, performing five times better than equivalent filament circuits before integration into the fabric.

Item Type: Journal article
Publication Title: Advanced Materials Technologies
Creators: Komolafe, A., Torah, R., Wei, Y., Nunes‐Matos, H., Li, M., Hardy, D., Dias, T., Tudor, M. and Beeby, S.
Publisher: Wiley VCH
Date: July 2019
Volume: 4
Number: 7
ISSN: 2365-709X
Rights: © 2019 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.
Divisions: Schools > School of Art and Design
Schools > School of Science and Technology
Record created by: Linda Sullivan
Date Added: 17 Jun 2019 10:01
Last Modified: 29 Aug 2019 11:29

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