Items where Author is "Nashed, M-N"

NASHED, M.-N., 2021. Encapsulating soldered electronic components for electronically functional yarn. PhD, Nottingham Trent University.

SHAHIDI, A., HUGHES-RILEY, T., MARASINGHE, K., NASHED, M.-N., OLIVEIRA, C. and DIAS, T., 2021. Process for manufacturing electronic yarns where the embedded components are soldered onto two parallel wires. [Digital or Visual Media]

HARDY, D.A., ANASTASOPOULOS, I., NASHED, M.-N., HUGHES-RILEY, T., KOMOLAFE, A., TUDOR, J., TORAH, R., BEEBY, S. and DIAS, T., 2019. Automated insertion of package dies onto wire and into a textile yarn sheath. Microsystem Technologies. ISSN 0946-7076

NASHED, M.-N., HARDY, D.A., HUGHES-RILEY, T. and DIAS, T., 2019. A novel method for embedding semiconductor dies within textile yarn to create electronic textiles. Fibers, 7 (2): 12. ISSN 2079-6439

HARDY, D.A., ANASTASOPOULOS, I., NASHED, M.-N., OLIVEIRA, C., HUGHES-RILEY, T., KOMOLAFE, A., TUDOR, J., TORAH, R., BEEBY, S. and DIAS, T., 2018. An automated process for inclusion of package dies and circuitry within a textile yarn. In: Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2018), Rome, Italy, 22-25 May 2018.

HARDY, D.A., OLIVEIRA, C., NASHED, M.-N. and DIAS, T., 2018. Textiles illuminated with electronic yarn. In: IDTechEx: Connecting Emerging Technologies With Global Brands, Estrel Convention Center, Berlin, Germany, 11-12 April 2018.