Items where Author is "Ochana, AR"
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Conference contribution
OCHANA, A.R., HUTT, D.A., WHALLEY, D.C., SARVAR, F. and AL-HABAIBEH, A., 2006. Modeling of the Power Cycling Performance of a Si on Si Flip Chip Assembly. In: 10th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronics Systems (ITHERM '06), San Diego, California, 30 May - 2 June, 2006.
