The use of high aspect ratio photoresist (SU-8) for super-hydrophobic pattern prototyping

Tools

Shirtcliffe, N.J., Aqil, S., Evans, C., McHale, G., Newton, M.I. ORCID: 0000-0003-4231-1002, Perry, C.C. ORCID: 0000-0003-1517-468X and Roach, P., 2004. The use of high aspect ratio photoresist (SU-8) for super-hydrophobic pattern prototyping. Journal of Micromechanics and Microengineering, 14 (10), pp. 1384-1389. ISSN 0960-1317

Preview

Text
188094_Postprint%20McHale%20J%20Micromech%20Microeng%20vol%2014%20p1384%202004.pdf
Download (1MB) | Preview

Official URL: http://dx.doi.org/10.1088/0960-1317/14/10/013

Abstract

In this work we present a reliable technique for the production of large areas of high aspect ratio patterns and their use as model super-hydrophobic systems. The high thickness and straight sidewalls possible with SU-8 were used to generate dense patterns of small pillars. The photoresist patterns could be used directly, without the need for micromoulding. A method is given allowing resist thickness to be varied over a wide range and a bottom antireflective layer was used to ease patterning on reflective substrates. This patterning technique allows rapid testing of wetting theories, as pattern size and depth can be varied simply and samples can be produced in sufficient numbers for laboratory use. We show how the static contact angle of water varies with pattern height for one sample-pattern and how static and dynamic contact angles vary with dimension using high aspect-ratio patterns.

Item Type:

Journal article

Description:

Post-print

Publication Title:

Journal of Micromechanics and Microengineering

Creators:

Shirtcliffe, N.J., Aqil, S., Evans, C., McHale, G., Newton, M.I., Perry, C.C. and Roach, P.

Publisher:

Institute of Physics Publishing

Place of Publication:

Bristol