The use of high aspect ratio photoresist (SU-8) for super-hydrophobic pattern prototyping

Shirtcliffe, NJ, Aqil, S, Evans, C, McHale, G, Newton, MI ORCID: https://orcid.org/0000-0003-4231-1002, Perry, CC ORCID: https://orcid.org/0000-0003-1517-468X and Roach, P, 2004. The use of high aspect ratio photoresist (SU-8) for super-hydrophobic pattern prototyping. Journal of Micromechanics and Microengineering, 14 (10), pp. 1384-1389. ISSN 0960-1317

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Abstract

In this work we present a reliable technique for the production of large areas of high aspect ratio patterns and their use as model super-hydrophobic systems. The high thickness and straight sidewalls possible with SU-8 were used to generate dense patterns of small pillars. The photoresist patterns could be used directly, without the need for micromoulding. A method is given allowing resist thickness to be varied over a wide range and a bottom antireflective layer was used to ease patterning on reflective substrates. This patterning technique allows rapid testing of wetting theories, as pattern size and depth can be varied simply and samples can be produced in sufficient numbers for laboratory use. We show how the static contact angle of water varies with pattern height for one sample-pattern and how static and dynamic contact angles vary with dimension using high aspect-ratio patterns.

Item Type:	Journal article
Description:	Post-print
Publication Title:	Journal of Micromechanics and Microengineering
Creators:	Shirtcliffe, N.J., Aqil, S., Evans, C., McHale, G., Newton, M.I., Perry, C.C. and Roach, P.
Publisher:	Institute of Physics Publishing
Place of Publication:	Bristol
Date:	2004
Volume:	14
Number:	10
ISSN:	0960-1317
Identifiers:	Number Type 10.1088/0960-1317/14/10/013 DOI
Rights:	Copyright ©2004 IOP Publishing Ltd.
Divisions:	Schools > School of Science and Technology
Record created by:	EPrints Services
Date Added:	09 Oct 2015 10:49
Last Modified:	09 Jun 2017 13:40
URI:	https://irep.ntu.ac.uk/id/eprint/18725

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