Electrodeposition of indium bumps for ultrafine pitch interconnection

Tian, Y., Liu, C., Hutt, D. and Stevens, B. ORCID: 0000-0002-3270-4040, 2014. Electrodeposition of indium bumps for ultrafine pitch interconnection. Journal of Electronic Materials, 43 (2), pp. 594-603. ISSN 0361-5235

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Item Type: Journal article
Publication Title: Journal of Electronic Materials
Creators: Tian, Y., Liu, C., Hutt, D. and Stevens, B.
Date: February 2014
Volume: 43
Number: 2
ISSN: 0361-5235
Identifiers:
NumberType
10.1007/s11664-013-2891-6DOI
Divisions: Schools > School of Science and Technology
Depositing User: Richard Cross
Date Added: 14 May 2019 12:20
Last Modified: 14 May 2019 12:20
URI: http://irep.ntu.ac.uk/id/eprint/36523

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