Electrodeposition of indium bumps for ultrafine pitch interconnection

Tian, Y, Liu, C, Hutt, D and Stevens, B ORCID: https://orcid.org/0000-0002-3270-4040, 2014. Electrodeposition of indium bumps for ultrafine pitch interconnection. Journal of Electronic Materials, 43 (2), pp. 594-603. ISSN 0361-5235

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Item Type:	Journal article
Publication Title:	Journal of Electronic Materials
Creators:	Tian, Y., Liu, C., Hutt, D. and Stevens, B.
Date:	February 2014
Volume:	43
Number:	2
ISSN:	0361-5235
Identifiers:	Number Type 10.1007/s11664-013-2891-6 DOI
Divisions:	Schools > School of Science and Technology
Record created by:	Richard Cross
Date Added:	14 May 2019 12:20
Last Modified:	14 May 2019 12:20
URI:	https://irep.ntu.ac.uk/id/eprint/36523

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