Reliability investigation of via-bridges for flexible electronics

Neto, J., Zumeit, A., Navaraj, W. ORCID: 0000-0003-4753-2015 and Dahiya, R., 2019. Reliability investigation of via-bridges for flexible electronics. In: 2019 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS), Glasgow, 8 July 2019.

Full text not available from this repository.
Item Type: Conference contribution
Creators: Neto, J., Zumeit, A., Navaraj, W. and Dahiya, R.
Date: July 2019
Identifiers:
NumberType
10.1109/fleps.2019.8792275DOI
Divisions: Schools > School of Science and Technology
Depositing User: Linda Sullivan
Date Added: 15 Aug 2019 13:39
Last Modified: 15 Aug 2019 13:39
URI: http://irep.ntu.ac.uk/id/eprint/37339

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