Reliability investigation of via-bridges for flexible electronics

Neto, J, Zumeit, A, Navaraj, W ORCID: https://orcid.org/0000-0003-4753-2015 and Dahiya, R, 2019. Reliability investigation of via-bridges for flexible electronics. In: 2019 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS), Glasgow, 8 July 2019.

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Item Type:	Conference contribution
Creators:	Neto, J., Zumeit, A., Navaraj, W. and Dahiya, R.
Date:	July 2019
Identifiers:	Number Type 10.1109/fleps.2019.8792275 DOI
Divisions:	Schools > School of Science and Technology
Record created by:	Linda Sullivan
Date Added:	15 Aug 2019 13:39
Last Modified:	15 Aug 2019 13:39
URI:	https://irep.ntu.ac.uk/id/eprint/37339

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