An automated process for inclusion of package dies and circuitry within a textile yarn

Hardy, DA ORCID: https://orcid.org/0000-0002-6028-7555, Anastasopoulos, I, Nashed, M-N ORCID: https://orcid.org/0000-0002-3152-4320, Oliveira, C, Hughes-Riley, T ORCID: https://orcid.org/0000-0001-8020-430X, Komolafe, A, Tudor, J, Torah, R, Beeby, S and Dias, T ORCID: https://orcid.org/0000-0002-3533-0398, 2018. An automated process for inclusion of package dies and circuitry within a textile yarn. In: Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2018), Rome, Italy, 22-25 May 2018.

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Abstract

The integration of small electronic components into textile fabrics, without compromising the textile qualities such as flexibility and conformability, is necessary in ensuring wider adoption of electronic textiles. A solution is to use flexible, electronic yarns that incorporate electronic components within the fibers of the yarn. The production of these novel yarns was initially a craft skill, with inclusion of electronics within each section of yarn taking 60–90 minutes. A prototype, automated production process was developed to speed up the manufacturing process to 6 minutes. This paper describes the process, using machinery and methods from both electronics and textiles applications.

Item Type:	Conference contribution
Creators:	Hardy, D.A., Anastasopoulos, I., Nashed, M.-N., Oliveira, C., Hughes-Riley, T., Komolafe, A., Tudor, J., Torah, R., Beeby, S. and Dias, T.
Date:	May 2018
Divisions:	Schools > School of Art and Design
Record created by:	Linda Sullivan
Date Added:	26 Jun 2018 08:34
Last Modified:	06 Feb 2019 10:05
Related URLs:	Organisation
URI:	https://irep.ntu.ac.uk/id/eprint/33911

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