A novel method for embedding semiconductor dies within textile yarn to create electronic textiles

Nashed, M-N ORCID: https://orcid.org/0000-0002-3152-4320, Hardy, DA ORCID: https://orcid.org/0000-0002-6028-7555, Hughes-Riley, T ORCID: https://orcid.org/0000-0001-8020-430X and Dias, T ORCID: https://orcid.org/0000-0002-3533-0398, 2019. A novel method for embedding semiconductor dies within textile yarn to create electronic textiles. Fibers, 7 (2): 12. ISSN 2079-6439

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Abstract

Electronic yarns (E-yarns) contain electronics fully incorporated into the yarn’s structure prior to textile or garment production. They consist of a conductive core made from a flexible, multi-strand copper wire onto which semiconductor dies or MEMS (microelectromechanical systems) are soldered. The device and solder joints are then encapsulated within a resin micro-pod, which is subsequently surrounded by a textile sheath, which also covers the copper wires. The encapsulation of semiconductor dies or MEMS devices within the resin polymer micro-pod is a critical component of the fabrication process, as the micro-pod protects the dies from mechanical and chemical stresses, and hermetically seals the device, which makes the E-yarn washable. The process of manufacturing E-yarns requires automation to increase production speeds and to ensure consistency of the micro-pod structure. The design and development of a semi-automated encapsulation unit used to fabricate the micro-pods is presented here. The micro-pods were made from a ultra-violet (UV) curable polymer resin. This work details the choice of machinery and methods to create a semi-automated encapsulation system in which incoming dies were detected then covered in resin micro-pods. The system detected incoming 0402 metric package dies with an accuracy of 87 to 98%.

Item Type:	Journal article
Publication Title:	Fibers
Creators:	Nashed, M.-N., Hardy, D.A., Hughes-Riley, T. and Dias, T.
Publisher:	MDPI
Date:	February 2019
Volume:	7
Number:	2
ISSN:	2079-6439
Identifiers:	Number Type 10.3390/fib7020012 DOI
Rights:	© 2019 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).
Divisions:	Schools > School of Art and Design
Record created by:	Jill Tomkinson
Date Added:	30 Jan 2019 14:37
Last Modified:	30 Jan 2019 14:37
URI:	https://irep.ntu.ac.uk/id/eprint/35737

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