Flexible FETs using ultrathin Si microwires embedded in solution processed dielectric and metal layers

Khan, S, Yogeswaran, N, Taube, W ORCID: https://orcid.org/0000-0003-4753-2015, Lorenzelli, L and Dahiya, R, 2015. Flexible FETs using ultrathin Si microwires embedded in solution processed dielectric and metal layers. Journal of Micromechanics and Microengineering, 25 (12): 125019. ISSN 0960-1317

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Abstract

This work presents a novel manufacturing route for obtaining high performance bendable field effect transistors (FET) by embedding silicon (Si) microwires (2.5 μm thick) in layers of solution-processed dielectric and metallic layers. The objective of this study is to explore heterogeneous integration of Si with polymers and to exploit the benefits of both microelectronics and printing technologies. Arrays of Si microwires are developed on silicon on insulator (SOI) wafers and transfer printed to polyimide (PI) substrate through a polydimethylsiloxane (PDMS) carrier stamp. Following the transfer printing of Si microwires, two different processing steps were developed to obtain top gate top contact and back gate top contact FETs. Electrical characterizations indicate devices having mobility as high as 117.5 cm2 V−1 s−1. The fabricated devices were also modeled using SILVACO Atlas. Simulation results show a trend in the electrical response similar to that of experimental results. In addition, a cyclic test was performed to demonstrate the reliability and mechanical robustness of the Si μ-wires on flexible substrates.

Item Type:	Journal article
Publication Title:	Journal of Micromechanics and Microengineering
Creators:	Khan, S., Yogeswaran, N., Taube, W., Lorenzelli, L. and Dahiya, R.
Publisher:	Institute of Physics
Date:	5 November 2015
Volume:	25
Number:	12
ISSN:	0960-1317
Identifiers:	Number Type 10.1088/0960-1317/25/12/125019 DOI
Divisions:	Schools > School of Science and Technology
Record created by:	Jonathan Gallacher
Date Added:	14 Aug 2019 12:40
Last Modified:	14 Aug 2019 12:40
URI:	https://irep.ntu.ac.uk/id/eprint/37307

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